Hub-type wheels are suitable for various cutting and notching applications such as silicon wafers, composite semiconductor wafers, etc. The bonding material is nickel-plated, and the blade thickness can be controlled within15±2μm with the appropriate diamond size. Various specifications are available to meet customer requirements. Hub-type wheels are easier to use than hubless wheels because of their hubs. Moreover, the inserts can be used with specially treated wheel edges to process difficult materials, such as wafers with metal films.
Processing Material | They are used for cutting semiconductors, composite silicon wafers, electronic materials, resins, metals, ceramics, composites, etc.
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