Metal Bond Diamond Band Saw Blades

Processing Method｜

Precision Cutting Tools

Applications｜

Materials Processing for the Optoelectronics Industry

Semiconductor Material Processing

The band saw (made of a ring-shaped, high-strength steel band sintered with metal) can accurately and efficiently cut large-diameter silicon ingots and other large-diameter materials and can be manufactured in a variety of sizes.

Processing Material | Silicon ingots, ceramics, etc.

From Cutting to Grinding, From EV to Semi

The Harder material You process,
The More experience TDC have.