CMP pad conditioners regenerate the pad surface to its optimum condition, correct the pad’s shape, and maintain the wafer polishing rate.
Processing Material | PU
ADD. | No.248, Hwa-kong St., Pa-Deh Dist., Taoyuan City, 33464 Taiwan
TEL | +886-3-363-6971
FAX | +886-3-362-0709
Email | sales@taiwandiamond.com