Surface Grinding Wheels for Wafers

Processing Method|

Surface grinding wheels are used to grind wafers including semiconductor wafers, electronic components, packaging and related reclaimed wafers. We offer the best diamond grinding wheel for each material. It helps reduce the damage layer caused by processing, improves process efficiency, reduces production cost, and can be reviewed for customization according to customer requirements.


Processing Material | Silicon Wafer, Silicon Carbide, Gallium Nitride, Gallium Arsenide, Indium Phosphide, Lithium Tantalate, Lithium Niobate, WLP, PLP, Aluminum Nitride, Aluminum Oxide… etc.

From Cutting to Grinding, From EV to Semi
The Harder material You process,
The More experience TDC have.