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Sapphire/Silicon Cutting Saw Blade

Processing Method|
Applications|

It is developed for high value workpieces such as sapphire and silicon crystal, features outstanding cutting performance for workpieces.

 

Processing Material | Especially suitable for high value workpieces such as sapphire and silicon crystal.

Related Products
Processing Method|
Applications|
From Cutting to Grinding, From EV to Semi
The Harder material You process,
The More experience TDC have.