Sapphire Backgrinding Wheels

Processing Method｜

Grinding

Applications｜

Materials Processing for the Optoelectronics Industry

It is used for grinding hard and brittle materials such as sapphire and glass wafers, realizing high cutting power, high target thickness achievement rate, and longer product lifetime, etc. Selecting specific process adjustments helps to improve process efficiency and reduce processing costs.

Processing Material | Sapphire and glass wafers

From Cutting to Grinding, From EV to Semi

The Harder material You process,
The More experience TDC have.