It is used for grinding hard and brittle materials such as sapphire and glass wafers, realizing high cutting power, high target thickness achievement rate, and longer product lifetime, etc. Selecting specific process adjustments helps to improve process efficiency and reduce processing costs.
Processing Material | Sapphire and glass wafers
ADD. | No.248, Hwa-kong St., Pa-Deh Dist., Taoyuan City, 33464 Taiwan
TEL | +886-3-363-6971
FAX | +886-3-362-0709
Email | [email protected]