Hubless blades are used for cutting electronic materials. Not only can specifications be set according to customer needs, but the blades can also be used with special treatments for difficult-to-process materials, such as ceramic substrates with silicone gel.
Processing Material | Silicon for semiconductor and compound wafers
ADD. | No.248, Hwa-kong St., Pa-Deh Dist., Taoyuan City, 33464 Taiwan
TEL | +886-3-363-6971
FAX | +886-3-362-0709
Email | sales@taiwandiamond.com