Hub Type Dicing Blades are used for cutting or grooving , especially used in wafer cutting, semiconductor PKGs processing.
Now, we could provide the 15µm ultra thin blade for precision cutting such as SiC or GaAs processing.
Various specifications are available to meet customer requirements.
Processing Material | Semiconductors, Composite silicon wafers, Electronic materials, Resins, Metals, Ceramics, Composites, etc.
ADD. ｜ No.248, Hwa-kong St., Pa-Deh Dist., Taoyuan City, 33464 Taiwan
TEL ｜ +886-3-363-6971
FAX ｜ +886-3-362-0709
Email ｜ sales@taiwandiamond.com
