Diamond Grinding Wheels for Silicon Wafers

Processing Method|

This diamond grinding wheel can be used for the surface grinding of various wafers, such as wafers of semiconductor materials and electronic devices. We offer the best diamond grinding wheel for each material. It helps reduce machining damage, improve machining efficiency and reduce machining costs, and can be customized to meet customer requirements.


Processing Material | Silicon semiconductor wafers, compound semiconductor materials, wide bandgap semconductor materials, (SiC, GaN), surface acoustic wave filters (LT, LN), sapphire glass wafers, ceramic wafers (Aluminum oxide, AlN)

From Cutting to Grinding, From EV to Semi
The Harder material You process,
The More experience TDC have.