Diamond particles are electroplated on the surface of high-strength wire by our special technology. It can cut multiple wafers at once in a short period of time. In addition, it has excellent performance for cutting hard and brittle materials. Since the water-soluble cutting fluid is used for cutting, swarfs can be recycled to achieve cost reduction and environmental protection.
Processing Material | Suitable for silicon carbide, silicon crystal , sapphire, glass, quartz, neodymium iron boron… etc.
