Case Study
Dicing Blades

SiC Wafer – Blades for stable machining under high load conditions


  1. Available in a variety of grain sizes and concentrations could be chosen.
  1. Apply to precision machining of difficult-to-machine materials due to its high wear resistance and high rigidity.
  1. The shape of the blade edge is not easy to deform, sustained stable and good machinability.
Spec H203JS-T4-035050
Size 55.58D-0.035T-19.05H-0.5L
Workpiece 4“ SiC N-type Substrate       (thickness: 300 um)
Application For school research
Feed rate 5  mm/s


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