Case Study
Dicing Blades
2023-04-06

SiC Wafer – Blades for stable machining under high load conditions

Features

  1. Available in a variety of grain sizes and concentrations could be chosen.
  1. Apply to precision machining of difficult-to-machine materials due to its high wear resistance and high rigidity.
  1. The shape of the blade edge is not easy to deform, sustained stable and good machinability.
Example
Spec H203JS-T4-035050
Size 55.58D-0.035T-19.05H-0.5L
Workpiece 4“ SiC N-type Substrate       (thickness: 300 um)
Application For school research
Feed rate 5  mm/s

 

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