Case Study
Dicing Blades

Dicing Blade For Si Wafer(SEMI Packing)


  1. With an emphasis on cutting performance, smooth surface on the edge.
  2. Superior wear resistance, reduce the cost and time.
  3. Achieves high productivity and superb dicing results.
Case Study
Specification WH253JM-T4-030090  (Electroforming Bond)
Size 55.58D-0.03T-19.05H-0.9L
Material Si wafer

•  Other sizes available upon request.

More information:


share to social networking sites